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Old 07-29-2007, 07:13 PM
     
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depressedVZWuse
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Join Date: 09-20-2005
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Quote:
Originally Posted by tsatryan View Post
Wouldn't the "innerds" of the i760 be completely sealed with the same kind of epoxy stuff that's encompasing the i730 board?
I am not so sure about that Pastor Tim. The i760 processor is a new manufacturing process for Samsung called POP (package on package). It appears that this allows for the DRAM / Flash memory to be on board with the proc and controllers. From reading their descriptions this is a modular setup with multiple peripheral interfaces, so it may be as simple as swapping a pluggable chipset at this point.

http://www.samsung.com/global/busine...eet_051116.pdf
 
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